🔶 Development Focus and Training Objectives

Based on students’ learning characteristics and industry workforce demands, this program is structured around two primary areas of development: “Training in Automatic Control and Robotics” and “Training in Hardware-Software System Integration.” Through these two core focuses, students are guided to build a solid theoretical foundation and practical skills, cultivating interdisciplinary expertise essential for the modern engineering field.

🔶 Career Orientation and Professional Development

The curriculum is designed with a strong career orientation, aiming to prepare students for professional roles such as Robotics Engineer and Firmware Engineer. In response to evolving industrial trends and technological advancements, the program adopts a dynamic curriculum design, regularly reviewing and updating course content to stay aligned with current industry practices. This approach helps ensure that learning materials remain relevant, practical, and accessible, avoiding outdated or overly complex content.

🔶 Teaching Philosophy and Learning Support

The program emphasizes identifying and nurturing students’ individual strengths and potential, focusing on ability-based learning that matches their aptitudes. A diverse evaluation system is implemented to reduce academic pressure and encourage active learning. Meanwhile, the curriculum enhances visualization and interactivity to balance theoretical understanding with hands-on practice, thereby improving learning effectiveness and engagement.

🔶 A New Era of Chip Design in Technological Evolution

With the rapid advancement of technology, the field of chip design and applications is undergoing a period of profound transformation. The rise of emerging technologies such as 5G, Artificial Intelligence (AI), Quantum Computing, and the Internet of Things (IoT) has redefined chip design—not merely as an innovation in hardware fabrication, but as a crucial core integrating multiple interdisciplinary technologies. These advancements are driving chip design toward higher performance, lower power consumption, and greater flexibility in application.

🔶 Cross-Disciplinary Integration and Future Technological Challenges

Amid growing industrial demands and technological challenges, future chip design will center on the fusion of high performance and energy efficiency, while integrating edge computing and IoT applications to achieve real-time, intelligent computational capabilities. At the same time, the exploration of quantum computing and new computing architectures will open up novel paradigms of computation, providing stronger support for data processing and artificial intelligence.

🔶 Design Innovation and Industrial Momentum

Moreover, the continuous evolution of advanced packaging technologies and automated design tools will further accelerate innovation in the semiconductor industry. AI-assisted design will make development processes more precise and efficient, leading to breakthroughs in system integration, energy efficiency, and computing power for next-generation chips. Through these advancements, chip design and applications will remain a driving force in the ongoing growth of the global technology industry.

🔶 Comprehensive Theoretical and Practical Learning Framework

The curriculum is built around semiconductor device physics and optoelectronic components, providing students with a solid theoretical foundation. It further connects to a series of hands-on courses in semiconductor fabrication, optical measurement, and packaging technologies, offering a complete and systematic learning framework that bridges theory with practical application.

🔶 Technological Advancement through Industry-Academia Collaboration

A key feature of the program lies in its focus on advanced semiconductor processing and measurement technologies. Through collaboration between academia and industry, research results are swiftly translated into real-world applications, effectively reducing the technology gap and promoting industrial innovation and advancement.

🔶 Forward-Looking Integration of Optoelectronics and Semiconductors

The long-term vision of the program is to integrate optoelectronic and semiconductor technologies to develop next-generation silicon photonic devices. By combining the strengths of both fields, the program aims to advance cutting-edge optoelectronic and semiconductor technologies while cultivating top-tier professionals for the global semiconductor and optoelectronics industries.

🔶 Intelligent Network System Development and Applications

This division is dedicated to the research and development of intelligent network management and cybersecurity technologies, including the design and implementation of smart network management systems, anomaly analysis systems, and automated network management platforms. By leveraging artificial intelligence and data analytics, the division aims to develop adaptive and resource-optimized network platforms that enhance digital resilience and cybersecurity, meeting the demands of future high-performance and secure network infrastructures.

🔶 High-Performance and Distributed Network Technologies

Research focuses on the design and implementation of high-performance distributed network traffic monitoring systems, enabling real-time traffic analysis and anomaly detection in large-scale network environments through distributed architectures. These technologies are widely applicable in data centers and cloud networks, enhancing overall network stability, scalability, and efficiency.

🔶 Next-Generation Wireless Communication and Antenna Technologies

The division also advances research in next-generation mobile communication and antenna technologies, including the integration of multi-antenna (MIMO) systems, the development of special-shaped and new-band antennas, and the implementation of 5G and 6G communication systems using software-defined radio. In addition, it explores heterogeneous wireless resource management and control to achieve efficient integration and coordination across multiple communication systems such as Wi-Fi and 5G.